| Aurostar Co : Gold- Cobalt alloy process |
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Excellent hardness (150 VHN ) |
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Operates at room temperature |
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Faster speed of depostion (1 microns in 3:30 min ) |
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Uniform 2N - 3 N rich colour |
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Suitable for Jewellary and PCB / electronics connectors |
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| Auromarc 155 : Gold - Indium alloy for Jewellary / Ornaments |
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Operates at very low Gold content 0.8 - 1.5 gm /lit |
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1N to 2 N colour |
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Hardness 150 to 200 VHN |
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Excellent wear reisitance |
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| Auroflash 725 - Flash Gold |
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Flash Gold plating bath |
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Decorative Colours of 2 N to 3 N |
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More suited for ABS plastics |
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Tollerates Nickel impurities |
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Uniform colour |
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Low operating Gold content (0.3 to 0.5 gms /lit ) |
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| Aurostrike DT - Strike Gold |
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Decorative and Technical applications |
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Available in Ni or Cobalt alloying formulation |
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Offers depassivating effect enhancing the further depsoit bonding |
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Intermdediate bath |
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Increases the main gold bath life |
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| Matt Silver Deposition |
| Silver-marc Ag 120 |
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Produces white, bright silver deposits |
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Can be used for depositing matt silver |
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Excellent for decorative jewellary |
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The desposit obtained can also be used for electrical and electronics applications |
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Two component brightner system |
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Suitable for rack and barrel applications |
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Exceptionally high throwing power |
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| Bronze plating as undercoats |
| Decorative Yellow Bronze - Bronzal YB * 700 |
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Decorative colour resembling to 2 N gold colour |
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Very effective as an undercoat for decorative gold plating |
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Makes gold plating economic by reducing the required thickness of Gold |
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Hard deposit (hardness value up top 350 VHN ) |
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Can be used as repacement for bright nickel ( Nickel free jewellary) |
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Easy to operate (supported by Units additions based on Amp-Min ) |
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| Decorative White Bronze - Bronzal WB * 750 |
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White colour, suitable as undercoat for Silver as well as final finish for jewellary |
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Excellent hardness (upto 350 VHN ) |
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Good wear resistance |
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| Palladium |
| Palla-marc Pd - 202 |
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Bright deposit |
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Can be used as a final finish or as a passive diffusion barrier undecoat for Gold plating |
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Suitable for electronics applications |
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| Antitarnish process for Silver plating |
| Anti Tar Ag |
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Organic molecule specially designed to protect electroplated Silver surface from tarnishing in all the atmospheric conditions |
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Immersion process operated at room temperature |
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Does not require baking after application just simply dry. |
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The organic molecule forms the bond with the silve surface providing a barrier between the atmosphere and hence the process is far different from organic lacquers. |
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Water base suspention uniformly reaches all over to components. |
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Requires continuous solution agitation to achieve exceptionally good results |
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