| PTH Chemicals |
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| Process |
Product |
Applications |
| Cleaner / Conditioner |
Unicon - 150 |
Cleans PCB holes, removes drilling debries, finger marks and other impurities. Prepares hoels for catalyst by imparting charges because of unique quaternery molecule |
| Microetch |
Microetch - 18 |
Powdered salt used for microetching the copper surface for enhancing the adhesion of copper deposition |
| Pre Dip |
Pre Dip C -100 |
Powdered salt for preparing the pre activator dip which acts as a sacrificial bath |
| Catalyst (Activator) |
Catalsyt C - 100 |
Palldium - Tin colloidal catalyst of fine particle size. Prepares thru hole surface for electroelss copper deposition |
| Post Activator |
Accelerator PA - 893 |
Post treats the Thru hole surface after catalyst for excellent adhesion of further electroless copper depsotion |
| Electroelss Copper |
MEC Cu - 806 |
Room temperature electroless copper bath, deposits uniform , void free copper uniformly |
| MEC Cu - 711 |
High temperature, stable Electroless Copper bath for high build thickness |
| MEC Cu- 202E |
EDTA based Electroless copper process, for low to high build thickness. It can be operated between 20 to 45 Deg C as per thickness requirement |
| Antitarnish |
Antitarnish Cu - 856 |
Organic formulation dip for preventing the copper surface from tarnishing |
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| High throw electrolytic copper Plating |
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| Process |
Product |
Applications |
| Copper Brightner |
High Throw Cu - 844 |
Single component additive for electrolytic copper plating bath. Deposit ductile copper. Enahnce the thrwoing power and uniform plating. |
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| Acid Tin Plating |
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| Process |
Product |
Applications |
| Acid Tin Plating |
Stanolex 201 |
Bright uniform tin electrodepostion. Compact plating, protecting the copper circutary without overhang |
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| Nitric Acid base strippers for Tin-Tin/Lead alloys from copper |
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| Process |
Product |
Applications |
| Stripping (Spray) |
Fine Strip 6000 SP |
Nitric Acid base stripper desigend for spray applications. Lower copper attack. Can operate at elevated temperature not more than 48 Deg C. |
| Stripping (Immersion) |
Fine Strip 1500 |
Nitric Acid base stripper designed specially for immersion applications. Non fuming easy to handle. Best suited for manual a handling. |
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| Ammoniacal Etchant replenisher |
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| Process |
Product |
Applications |
| Etching |
Fine Etch 150 R |
Ammonical etching solution replenisher. Maintains the copper content and speed of operations, pH of solution. Maintains the solution sludgefree |
| Fine Etch 200 LR |
Etchant replanisher designed for innerlayers for MLB, where dry film is used as etch resist. |
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| Dry Film stripper |
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| Process |
Product |
Applications |
| Dryfilm stripping |
DFS 509 OG |
Organic dryfilm stripper suitable for spray application. Does not attack on tin brightness. Removes dry film quickly leaving copper surface ultra clean for fine etching. |
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| Gold and Gold-Cobalt plating for connectors |
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| Process |
Product |
Applications |
| Gold - Cobalt plating |
Aurostar Co |
Deposit hard gold with a very effective speed of depsotion (1 Microns in 3:30 mins). Hard depsoit with low contact resistance. Suitable for barrel applications in case of phosphor bronze pin connectors. |
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| Immersion gold for Surface mount Devices |
| Process Cycle for Immersion Gold for Electronics |
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| Step |
Process |
Product |
Function |
| 1 |
Acid Cleaner |
Acid Cleaner # 10 |
Cleaner for Copper surface, removes residues |
| 2 |
Microetch |
Microetch 118 |
Microetches the copper surface for improved adhesion |
| 3 |
Acid Dip |
10% Sulphuric Acid |
Removes smut from copper surface |
| 4 |
Activator |
Activator C - 100 |
Ionic Palladium activator, which facilitate the Electroless Nickel plating without bridging the circuit tracks |
| 5 |
Electroless Nickel |
Marshal EN 9304 |
Special EN system designed for Immersion gold deposition. Operates at lower temp range. ( 75 Deg C) |
| 6 |
Immersion Gold |
Immersion Gold Au 101 |
Offers, adherent, bright gold deposit thickness around 0.1 microns. |
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