| High Phosphorus (10 to 12 % ) |
| |
| Process |
P Content |
Products |
Features |
Applications |
| High Phosphorus |
10 - 12 % |
| • |
Marshal EN 825 |
| • |
Marshal EN 9304 |
|
| • |
Semibright deposit |
| • |
Offers high corrosion resistance, 1000 Hrs Salt Spray |
| • |
Non Magnetic Amorphous |
|
| • |
Oil/Petroleum Industrial vales and other components. |
| • |
All components exposed to atmosphere |
| • |
Computers |
| • |
Printed Circuit Boards |
|
|
| |
|
| |
| Medium Phosphorus ( 8 to 10 %) |
| |
| Process |
P Content |
Products |
Features |
Applications |
| Medium Phosphorus |
8 - 10 % |
| • |
Marshal EN 832 |
| • |
Marshal EN 855 |
|
| • |
Bright Lustorus deposits |
| • |
Higher plating speed ( > 15 microns/ hr ) |
| • |
Higher Metal Turn overs |
| • |
Medium Corrosion resistance
(100 Hrs Salt Spray ) |
|
| • |
Printers and Type writers |
| • |
Computer/ business machines |
| • |
Industrial components |
|
|
| |
|
| |
| Low Phosphorus ( 3 to 5 % ) |
| |
| Process |
P Content |
Products |
Features |
Applications |
| Low Phosphorus |
3 - 5 % |
|
| • |
Bright Deposit |
| • |
Higher Hardness value
(50 R C) |
| • |
Ductile Deposit |
| • |
Suitable for Wire Bonding / Soldering in case of PCBs |
|
| • |
Dies |
| • |
Printed Circuit Boards |
| • |
Industrial Components where high hardness is required |
|
|
| |
|
| |
Alkaline
Alkaline - Marshal EN 804 |
| |
| Process |
P Content |
Products |
Features |
Applications |
| Alkaline |
< 3 % |
|
| • |
Room temperature electroelss nickel |
| • |
Stable alkaline formulation |
| • |
Uniform coverage |
|
| • |
ABS Plastic plating undercoat |
|
|
| |
|
| |
| Alkaline - Marshal EN - Al 105 |
| |
| Process |
P Content |
Products |
Features |
Applications |
| Alkaline |
< 3 % |
|
| • |
Room temperature electroelss nickel |
| • |
Stable |
|
| • |
Overcoat after Zincate layer on Aluminum surface as a sacrificial bath, prior to Electroless Nickel plating on Aluminium. |
|
|
| |
|
| |
| Electroless Nickel plating on Aluminum |
| |
| Marshal Laboratories provide a special formulation ( Marshal EN 832 ) for plating on Al without using intermediate barrier Alkaline Electroless Nickel. Typical process cycle ; |
| |
|
